Dr. Takahiro Namazu’s Paper Selected as Cover Art for Experimental Techniques

Dr. Takahiro Namazu’s paper “Nine Point Bending Test Technique for Understanding of Sintered Silver Die Bonding Failure Mechanism” submitted to Springer Journal, Experimental Techniques, has been selected as the cover art for the journal’s Volume 48, Issue 3. This journal focuses on advanced and new experimental techniques. Dr. Namazu and Keisuke Wakamoto, a former doctoral student of his laboratory, submitted a new experimental technique developed to evaluate the reliability of nano-silver sintering die attach assemblies, which is expected to be used as promising die bonding technique for power semiconductors. Normally, the reliability of die-bonded assemblies is evaluated by thermal shock tests, but they devised a nine-point bending test technique that deteriorates die attach assemblies using only mechanical forcing. The figure selected for the cover art explains the principle of this experimental setup and the stress and strain distribution. Please have a look at the article on this new technology recognized worldwide.

(Hiroshi Kawakami, Faculty of Engineering)